영어에서 May be formed 을 사용하는 예와 한국어로 번역
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Colloquial
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Ecclesiastic
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Ecclesiastic
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Programming
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Computer
Other such linkages may be formed.
Antennas 40 may be formed using any suitable types of antenna.
In later stages an ulcer may be formed.
The ATC policies may be formed via various means.
In the annealed condition, 410 stainless steel plate is ductile and may be formed.
Note that the control circuit may be formed over the panel 1601.
The image often appears to move as it is tilted,hence kinematic 3D images may be formed.
The gate insulating film 1007 may be formed by plasma CVD or sputtering.
CC masks may be formed in a variety of ways, for example, a photolithographic process may be used.
This non-conductive material can be colored or colorless and may be formed on the by printing or other techniques.
The housing 702 may be formed of a variety of materials including metal and plastic.
For example, a process layer that may be composed of a variety of different materials may be formed across a semiconductor wafer.
A channel estimate may be formed based on one or more LTFs received at the beginning of the data unit.
Also as still another method of forming the barrier layer 56, a thin oxide film may be formed by heating to approximately 200 to 350° C. with a clean oven.
The cathodes and the EL layer may be formed only in the pixel portion at this point; it is not necessary to form them on the driver circuits.
Although some materials that are commonly used to form permanent magnetsare difficult to machine, simple patterns may be formed in at least the tip section.
The 40 MHz, and/or 80 MHz, channels may be formed by combining contiguous 20 MHz channels.
The qualification wafers 18 from the plasma processed cassette 6 may then be tested(destructively or non-destructively), while semiconductor devices may be formed from the production wafers 18.
The memory interface 1170 may be formed to support a NAND flash memory or a NOR flash memory.
In this case, because select transistors S1 and S2 andnonvolatile memory elements M0 to M31 are connected in series, these may be formed as a single unit over a single semiconductor layer.
For example, the outer cover 117 may be formed from a thin plastic film or other flexible liquid-impermeable material.
Note that the capacitor 623 is not necessarily formed over the same layer asthe second transistor 620, and for example, the capacitor 623 may be formed over the same layer as the first transistor 501 and the third transistor 502.
However, it is understood that the fastener tabs 65 may be formed of a hook material and thus comprise the hook fasteners 71 without departing from the scope of this invention.
If a more cloth-like feeling is desired, the outer cover 117 may be formed from a polyolefin film laminated to a nonwoven web.
For example, a lighting system may be formed with use of white light emission, or an area-color light-emitting device may be formed with the use of a single color light emission.
For example, the first user input unit 116 may be formed to receive information such as numbers, characters, and/or symbols.
For example, the anchor elements may be formed from a polymer(e.g., a polyurethane such as CARBOTHANE®) and springs may be formed from a metal material(e.g., 316 stainless steel).
The cathodes and the EL layer may be formed only in the pixel portion at this point;
The EL layer and the cathode may be formed only in the pixel portion at this point, and it is not necessary to form them on the driving circuits.
The first transistor(Tr1) or the third transistor(Tr3) may be formed using a semiconductor thin film, or may be formed using a bulk semiconductor substrate.