EddyCus® TF Series(Thin-Film)comprises a set of devices for contactless real-time testing of the sheet resistance of thin films utilizing contact free eddy current testing technology.
It is with high power density, low sheet resistance, small resistance drift, and perfectly match with the general dielectric paste, overglaze paste and conductor paste.
Differences with Si-MOSFETs: Internal Gate Resistance The internal gate resistance Rg of an SiC-MOSFET(chip)itself depends on the sheet resistance of the gate electrode material and the chip size.
EddyCus® TF map 2525SR and5050SR are gauges for fast mapping of sheet resistance, thickness, layer homogeneity, and conductivity effects and defects of conductive films and thin material systems on glass, wafer, and foils.
EddyCus® TF lab 4040SR is a single-point measuringdevice for quick non-contact film characterization of sheet resistance and layer thickness of large samples in laboratories, R&D centers, and quality assurance departments of manufacturing firms.
Offering uniquely broad PVD manufacturing capability for titanium, metallic titanium nitride(TiN), and fully-nitrided TiN deposition in the same chamber without hardware changes, Extensa TTN can also accommodate Cs liner and bond pad applications.The system's uniform step coverage and sheet resistance(non-uniformity<3% 1σ) allows a thinner barrier stack to be deposited, to reduce overhang and facilitate void-free gap fill.
シート抵抗[Ω/□]。
Sheet resistance[Ω/□].
シート抵抗≤50mΩ/sq。
Sheet Resistance:≤40 mΩ/sq.
シート抵抗または厚さのリアルタイムの陳述。
Real-time depiction of sheet resistance or thickness.
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