Encapsulation technology originated with the pharmaceutical industry.
Challenges of Using Advanced Package Technologies in Automotive Applications.
SOIC Small outline integrated circuit, a packaging technology.Lee博士还撰写了各种关于各种封装技术相关主题的研究论文,并在韩国获得38项专利,在美国获得21项专利。
Dr. Lee also haswritten various research papers on various packaging technology related subjects and was granted 38 patents in Korea and 21 patents in the US.他撰写了210多篇研究论文(包括19篇综述文章和13本书章节),并拥有8项封装技术专利。
He is author of more than 210 research papers(including 19 review articles and 13 book chapters)and has 8 patents on encapsulation technology.Combinations with other parts of speech
公司成立于2000年,专业生产激光焊接光子封装技术,探测器,高频接收机和发射机以及众多客户的具体设计。
Founded in 2000 the company specializes in laser welded photonic packaging technology to produce lasers, detectors, high frequency receivers and transmitters and numerous customer specific designs.然而,新系统将使用英特尔3D封装技术创建的组件,可以生产更精简,更节能的芯片。
However, the new system willuse components created by Intel's 3D packaging technology, which can produce leaner, more power-efficient chips.他是210多篇研究论文(包括19篇评论文章和13本书章节)的作者,拥有8项封装技术专利。
He is author of more than 210 research papers(including 19 review articles and 13 book chapters)and has 8 patents on encapsulation technology.李春兴曾撰写了23篇关于各种封装技术相关学术论文,并获得由韩国批准的26项专利和美国批准的11项专利。
Li has written 23 papers on various packaging technologies and won 26 patents approved by South Korea and 11 patents approved by the United States.豪威科技提供图像传感器、图像信号处理(ISP)和晶圆级封装技术,旨在满足所有这些应用的特定需求。
OmniVision provides image sensors, image signal processing(ISP)and wafer-level packaging technologies designed to meet the specific needs of all these applications.据了解,如今采用COB封装技术的小间距LED屏,已经被称为“第二代”小间距LED产品了。
It is understood that thesmall-pitch LED display using COB packaging technology has been called the second generation of small-pitch LED products.经过40多年的发展,LED封装技术和结构先后经历了四个阶段,如图4所示。
After more than 40 years of development, LED packaging technology and structure have gone through four stages, as shown in figure 4.ERamp项目研究活动的重点是快速推出全新的生产技术,进一步开发功率半导体的芯片封装技术。
ERamp research activities will focus on the rapid introduction of new production technologies andfurther exploration of chip packaging technologies for power semiconductors.COB封装技术能在小间距显示屏产品应用上广受厂家欢迎,必然有它独特魅力所在。
COB packaging technology can be widely welcomed by manufacturers in the application of small-pitch display screen products, and it must have its unique charm.ERamp研究活动将着重于全新生产技术的快速开发,并进一步探索功率半导体的晶片封装技术。
ERamp research activities will focus on the rapid introduction of new production technologies andfurther exploration of chip packaging technologies for power semiconductors.进一步加强这些核心技术的关键,在于效率的提升以及面钝化、散热和封装技术的发展。
The key to further strengthening these core technologies lies in the improvement of efficiency and the development of surface passivation,heat dissipation and packaging technology.研究的新技术包括制造非常小的表面发射LED芯片和封装技术等。
New approaches that were investigated included manufacturingvery small surface-emitting LED chips and packaging technologies, among other things.除了先进的技术节点以外,双方还有意探索其他可能开展合作的领域,如晶片封装合作和3D封装技术等。
In addition to advanced technology nodes, the two companies intend to explore other areas to collaborate on such as die-package interaction and3D packaging technologies.微电子机械系统(MEMS)的新兴应用,CMOS图像传感器和封装技术,如通过硅….
Emerging applications in micro-electro-mechanical systems(MEMS), CMOS image sensors and packaging technologies such as through-silicon….三、看“灯珠品质”:灯珠品质决定于芯片品质和封装技术。
Third, look at“lamp bead quality”:lamp bead quality depends on the chip quality and packaging technology.这使得前瞻性的系统架构和制造方法,即使是原型和小型系列,也能够结合最先进的装配和封装技术使用。
This enables the use of forward-looking system architectures and manufacturing methods, even for prototypes and small series,in conjunction with state-of-the-art assembly and packaging technologies.三、看“灯珠品质”:灯珠品质决定于芯片品质和封装技术。
Look at"light quality":the quality of the lamp is determined by the chip quality and packaging technology.看“灯珠品质”:灯珠品质决定于芯片品质和封装技术。
Look at"light quality":the quality of the lamp is determined by the chip quality and packaging technology.看“光质”:灯的质量是由芯片质量和封装技术决定的。
Look at"light quality":the quality of the lamp is determined by the chip quality and packaging technology.轻薄短小、精致可爱的苹果产品带给消费者无尽的享受,而现代先进封装技术对其贡献功不可没。
Thin, small, exquisite and lovely Apple products give consumers endless enjoyment,and modern advanced packaging technology contributes to its contribution.三,观察“光质”:灯具质量由芯片质量和封装技术决定。
Look at"light quality":the quality of the lamp is determined by the chip quality and packaging technology.台积电已经锁定了苹果A10和A11处理器业务,部分原因在于台湾晶圆代工厂在封装技术方面的竞争优势。
TSMC has locked up Apple's A10 and A11 processor business in part because of a competitiveadvantage the Taiwan foundry has gained in packaging technology.进一步增强这些核心技术的关键在于效率的提高以及腔面钝化、散热和封装技术的发展。
The key to further strengthening these core technologies lies in the improvement of efficiency and the development of surface passivation,heat dissipation and packaging technology.