焊盘 英语是什么意思 - 英语翻译

• pads
• land
• pad

在 中文 中使用 焊盘 的示例及其翻译为 英语

可在任何焊盘材料（Al或Au）上实现高性能.
High performance on any pad material(Al or Au).

本焊盘图设计基于IPC-7351指南。
This Land Pattern Design is based on the IPC-7351 guidelines.

基于IPC标准，焊盘开口等于UBM开口。
Based on the IPC standard, the pad opening equals the UBM opening.

此焊盘图案设计基于IPC-7351指导方针。
This Land Pattern Design is based on the IPC-7351 guidelines.

触点应足够清洁以穿过焊盘孔。
The contacts should be clean enough to pass through the solder pad holes.

此焊盘图案设计基于IPC-7351指导原则。
This Land Pattern Design is based on the IPC-7351 guidelines.

此时测试焊盘应该大于或等于1.3mm。
At this point the test pads should be greater than or equal to 1.3mm.

他人被放置在非导电焊盘和完全的一侧工作。
Others are placed on non-conductive pads and work entirely on one side.

实际上，我们只需要弄清楚PCB焊盘的总量。
Actually, we only have to figure out the total quantities of PCB pads.

Rthsp-pcb=焊盘与PCB底面之间的热阻。
Rth sp-pcb= Thermal resistance between solder pad and underside of PCB.

所以，工程师们才想出了各种各样的办法来保护焊盘。
Therefore, engineers have come up with a variety of ways to protect the pad.

焊盘有没有受到污染，这可以用离子污染测试得出结果；.
Whether the pad is contaminated, this can be obtained by ion contamination test;

通过这种方式，我们可以轻松计算出直至现在的PCB焊盘总量。
In this way, we can easily work out the total quantities of PCB pads until now.

不同制造工艺对PCB上的焊盘会有啥影响和要求？?
What are the effects and requirements of different PCB manufacturing processes on the pads?

双面板的两面都有焊盘，主要用于和其他电路板的连接。
Both sides of the two panels have pads, mainly used in connection with other circuit boards.

Rthj-sp=LED结点与之间的热阻PCB上的LED安装焊盘;
Rth j-sp= Thermal resistance between LED junction and LED mounting solder pad on the PCB;

焊盘外径D一般不小于(d+1.2)mm,其中d为引线孔径。
The pad outer diameter D is generally not less than(d+ 1.2) mm, where d is the lead aperture.

双面板的两面都有焊盘，主要用于和其他电路板的连接。
Both sides of the double panel have pads that are primarily used for connections to other boards.

某些半金属焊盘中的金属含量被发现是某些生产商的制动尖叫源。
The metal content in some semi-metallic pads was found to be the source of brake squeal for some manufacturers.

对高密度的数字电路，焊盘最小直径可取d+1.0mm。
For high density digital circuit, the minimum diameter of the welding disc is recommended(d+1.0)mm.

焊盘这个蒙面，无焊接结束时将被插入到在步骤4.1中所述的FFC连接。
This masked, solder-free end of the pads will be inserted into the FFC connector described in step 4.1.

电路板上不同组件相临焊盘图形之间的最小间距应在1MM以上。
The minimum spacing between adjacent pad patterns of different components on the circuit board should be above 1MM.

当焊接两个或多个印刷电路板时，焊盘孔也被润湿并填充。
(3) When the two or more printed circuit boards are soldered, the pad holes are also wetted and filled.

双面板的结构：双面板的两面都有焊盘，主要用于和其他电路板的连接。
Double-panel structure: Both sides of the double-sided panel have pads, which are mainly used for connection with other boards.

大型元件（如变压器，直径15mm以上的电解电容器，大电流插座）应增加焊盘。
Large components(such as transformers, electrolytic capacitors with diameters of 15mm or more, large current socket) should increase the pad.

前面讨论的过孔模型是每层均有焊盘的情况，也有的时候，我们可以将某些层的焊盘减小甚至去掉。
The cross hole model discussed above is a pad for each layer, and sometimes we can reduce or even remove some layers of pads.

进行化验，大多数临床实验室使用与测试焊盘商业准备试纸有化学物质渗透到他们。
To perform the chemical examination, most clinical laboratories use commercially prepared test strips with test pads that have chemicals impregnated into them.

根据客户的要求，CeraPad的接触焊盘可适用标准SAC(Sn/Ag/Cu,260°C)回流焊或共晶焊(AuSn,320°C)工艺。
Depending on customer requirements, the CeraPad contact pads can be designed for both standard SAC(Sn/Ag/Cu, 260 °C) reflow processes and eutectic bonding(AuSn, 320 °C).

而垂直喷锡工艺很难将成细的焊盘吹平整，这就给SMT的贴装带来了难度；.
And the vertical spray tin process is difficult to fine into the pad flat, which SMT to the placement of the difficulty;