Примери за използване на Thermal expansion coefficient на Английски и техните преводи на Български
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Low thermal expansion coefficient.
Substrate and epitaxial film thermal expansion coefficient match;
Smaller thermal expansion coefficient and less anisotropy.
And the characteristics of small thermal expansion coefficient.
In a metal the thermal expansion coefficient greater than that of brick.
SAF 2507 has high compressive strength,impact strength and low thermal expansion coefficient and high thermal conductivity.
Low thermal expansion coefficient(8.1× 10- 6K-1); good electric conductivity;
Properties of Molybdenum-copper alloy- with low thermal expansion coefficient can be adjusted.
Low thermal expansion coefficient, which makes it possible to lay the steel tubes in concrete.
High heat distortion temperature,low thermal expansion coefficient, equivalent to metal alloys.
Thermal expansion coefficient is close to silicon, simplify the production process of power module.
Compared with stainless steel, the steel has low thermal expansion coefficient and good thermal conductivity.
Its thermal expansion coefficient is somewhat lower than that of steel and less than half that of aluminum.
For isotropic materials the volumetric thermal expansion coefficient is three times the linear coefficient: .
Small thermal expansion coefficient: 50% of non-pound steel and aluminum, suitable for engine valves and other components;
Steel is used because it binds well to concrete,has a similar thermal expansion coefficient and is strong and relatively cost-effective.
The volumetric thermal expansion coefficient is the most basic thermal expansion coefficient, and the most relevant for fluids.
For common materials like many metals and compounds, the thermal expansion coefficient is inversely proportional to the melting point.
(5) Small thermal expansion coefficient is 50% of stainless steel and aluminum, suitable for engine valve and other components;
For a solid, we can ignore the effects of pressure on the material, and the volumetric thermal expansion coefficient can be written:[5].
The linear thermal expansion coefficient a[1/°C].
LED thermal substrate materials require high electrical insulation, high stability,high thermal conductivity and thermal expansion coefficient(CTE), flatness and high strength that match the chip.
Similarly, the area thermal expansion coefficient is two times the linear coefficient: .
At present, the organic material especially for epoxy resin materials at low prices and mature art for the most part still in PCB production, andthe conventional organic printed circuit board from two aspects of heat dissipation and thermal expansion coefficient matching sex, can not meet the requirements of semiconductor circuit integration enhances unceasingly.
Minimum thermal expansion coefficient makes the use of the steel at low temperature differences, for example, heat transfer systems.
Dimensional stability, electrical conductivity,thermal conductivity, thermal expansion coefficient, self-lubricating and seismic absorption and a series of excellent performances.
The thermal expansion coefficient is a helpful indicator to predict and quantify how a material changes its shape in response to temperature changes.
Mo-Cu alloys as many physical properties such as non-magnetic,fixed thermal expansion coefficient, high elastic modulus, high electrical conductivity, thermal conductivity, etc.
Linear thermal expansion coefficient, annealing characteristics and other physical or chemical changes manifesting themselves as a change of dimensions can be precisely determined.
Adoption of world famous reflecting metal tape measuring scale system,which has a close thermal expansion coefficient with most work piece and assure a good repeatability.