英語 での Electroless plating の使用例とその 日本語 への翻訳
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Various electroless plating solutions.
Various electroplating, electroless plating.
Electroless Plating- Copper Electroplating:.
Electroplating and electroless plating.
Electroless Plating- Nickel Electroplating:.
It is possible to use it also with Electroless plating.
Electroless plating: Gold, copper, nickel, and so on.
(3) Coating technology, including electroless plating.
Electroless plating, Welding plating, coating.
Our standard thickness for electroless plating is 5±2μm.
Is electroless plating formed uniformly on any shape in general?
Horizontal-type barrel for 3.5 inch magnetic-disc, electroless plating.
Pioneer of electroless plating Japan Kanigen Co., Ltd.
The first metallayer 30 may be formed by electroless plating.
Bump formation by electroless plating- Low facility cost.
The second metallayer 33 may be formed by electroless plating.
Electroless plating bath Substitution type gold plating(primary nickel plating).
Developed electromagnetic shield plating technology by electroless plating.
P059 Preparation and structure of electroless plating film of gold suitable for SEIRAS.
Detailed investigation revealed that this was because of small voids in the electroless plating film.
We provide Ni/Pd, Ni/Pd/Au, and electroless plating solutions, with superior bondability.
Electroless plating bath Replacement type electroless silverplating(primary copper plating).
Types of plating: Electrolytic and electroless plating of copper, nickel, gold and so on.
Electroless plating is suitable for precision machine parts because the plating thickness is uniform in all parts irrespective of product shape.
We have started"Under Bump Metallurgy(UBM)formation service" using electroless plating process, unique to us.
In some embodiments, the electroless plating of block 308 can be followed by cleaning of substrate 106 of block 310 in cleaning facility 222.
Products that have undergone electroplating or electroless plating, nonwoven fabrics that have undergone special plating, tin sludge collected from water used for washing tin-plated products, and so on.
Electroless plating is used extensively for the surface treatment of small items such as electronic components and cell phones. Lactic acid is widely used as a complexing agent in electroless and other plating processes.
Our company's UBM processing employs electroless plating to offer lower costs, shorter delivery times, and greater miniaturization, and offers the added advantage of being an environmentally friendly technology.