What is the translation of " SENSOR CHIP " in Chinese?

• 传感器芯片
• 感测器晶片

Examples of using Sensor chip in English and their translations into Chinese

The program handles the most common sensor chips.
该程序处理最常见的传感器芯片。

The ToF image sensor chip directly measures the distance to objects.
ToF图像传感器芯片直接测量到对象的距离。

The heart of the camera system is the 3D image sensor chip.
摄像系统的核心是3D图像传感器芯片。

Demos with REAL3 3D image sensor chip are available.
采用REAL33D图像传感器芯片的演示产品现可供货。

As far as he knows, no other company is making such a high-resolution UWB sensor chip.
据他所知，还没有其它任何一家公司能够制造这样一种高分辨率的UWB传感器芯片。

Develops advanced CMOS image sensor chips, providing 3D solutions for high volume markets.
开发高级的CMOS图像传感器芯片，为大批量市场提供3D解决方案。

To achieve this innovation, it is impossible to rely solely on sensor chip manufacturers.
而要实现这一创新，仅仅依靠传感器芯片厂商是无法实现的。

Infineon's 3D image sensor chip of the REAL3™ family is based on the Time-of-Flight(ToF) technology.
英飞凌REAL3™系列的3D图像传感器芯片基于飞行时间（ToF）技术。

At present, sensor imports account for 80%, and sensor chip imports account for 90%.
目前，传感器进口占80％，传感器芯片进口占90％。

Line scan camera system: Supports focusing mechanisms and usually contains a line scan sensor chip.
线扫描相机系统：支持聚焦机制，通常包含线扫描传感器芯片。

At present, sensor imports account for 80%, and sensor chip imports account for 90%.
目前，传感器进口占80％，传感器芯片进口占比高达90％。

Our 3D image sensor chips enable augmented reality applications with an impressive realistic quality.”.
我们的3D图像传感器芯片能为增强现实应用带来令人印象深刻的写实性。

The optical pixel sensitivity of the new 3D image sensor chips are now double that of the previous version.
现在，全新3D图象传感器芯片的光学像素灵敏度是前一代产品的两倍。

The REAL3 image sensor chip is the key component of the world's smallest 3D camera module for smartphones.
REAL3图像传感器芯片是世界上最小的操操在线观看手机专用3D摄像头模块的关键组件。

A key aspect of the convergence process has been the development of a new generation of sensor chips, such as temperature and pressure sensors..
融合过程中的一个重要方面就是新一代传感器芯片的发展，比如说温度和压力传感器。

Vayyar's sensor chip has 24 transceivers running in frequencies from 0- 20 GHz, and will soon feature 72.
Vayyar的传感器芯片有24个收发器，运行频率为0-20千兆赫，且很快将达到72千兆赫。

At the heart of the design is a novel piezoresistive sensor chip, one that can measure transient accelerations up to 100,000 g.
设计方案的核心是一种新型压阻式传感器芯片，它能够测量高达100,000g的瞬态加速度。

Often, sensor chips are connected to the SoC through a sensor hub, allowing some low-power monitoring and processing of the data.
通常，传感器芯片通过传感器中枢连接到SoC，允许对数据进行一些低功耗的监控和数据处理。

The program handles the most common sensor chips, like ITE® IT87 series, most Winbond® ICs, and others.
程序处理最常见的传感器芯片，像ITE®IT87系列，大多数华邦®ICs，和其他人。

Imec contributes its advanced expertise in high-frequency system, circuit and antenna design for radar applications thus complementing Infineon's radar sensor chip knowledge.
IMEC将贡献其在雷达运用上的专业，提供高频系统、电路与天线设计，进一步补足Infineon对雷达感测芯片的专业知识。

LG will use Infineon's REAL3 image sensor chip in the upcoming G8 ThinQ, but what is a time-of-flight camera?
LG将在即将面世的G8ThinQ中使用英飞凌的REAL3图像传感器芯片，但是什么是飞行时间相机?

Other image sensor chip applications include the spatial measurement of rooms and objects, indoor navigation and the implementation of special photo effects.
图像传感器芯片的其它应用包括：房间和物体的空间测量、室内导航和图片特效等。

Potential applications for these advanced navigation sensor chips include targeting, positioning, guidance, navigation and smart weapons.
未来，这些技术可用于先进的导航传感器芯片，包括目标指示、定位、制导、导航和灵巧武器等。

Other image sensor chip applications include the spatial measurement of rooms and objects, indoor navigation and the implementation of special photo effects.
其他影像感测器晶片应用包括房间及物体的空间测量、室内导航，以及特殊相片效果的实作。

Sony and Microsoft said they will potentially develop new image sensor chips that use Microsoft's artificial intelligence technology for business customers.
索尼和微软表示，他们可能会开发新的图像传感器芯片，使用微软的人工智能技术为商业客户服务。

With the 3D image sensor chip from Infineon Technologies AG the unlock-with-your-face feature becomes smarter, faster and more reliable.
凭借英飞凌公司推出的3D图像传感器芯片，脸部识别解锁功能会变得更智能、更快捷、更可靠。

Infineon and pmd will be showcasing the latest 3D image sensor chip of the REAL3 family at the Consumer Electronics Show(CES) 2016 in Las Vegas.
英飞凌和pmd将在2016年于美国拉斯维加斯举行的消费性电子展（CES）展出REAL3系列最新的3D影像感测器晶片。

The three new REAL3 3D image sensor chips are all equipped with microlenses and have almost the same level of optical performance and functionality.
此外，三款新型REAL33D影像感测器晶片均配备微镜头，在光学效能及功能方面也几近相同。

The KMA210 incorporates NXP's latest magnetoresistive sensor chip and a unique signal conditioning ASIC developed in NXP's advanced Silicon on Insulator(SOI) ABCD9 process technology.
KMA210集成了恩智浦最新的磁阻传感器芯片以及基于恩智浦先进的绝缘硅(SOI)ABCD9工艺制成的独特信号调理ASIC电路。

The three new REAL3 3D image sensor chips are all equipped with microlenses and have almost the same level of optical performance and functionality.
三款全新推出的REAL33D图象传感器芯片全部配备微透镜，在光学效能和功能方面也几近相同。