Examples of using Component placement in English and their translations into Croatian
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Colloquial
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Ecclesiastic
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Computer
The next step after component placement is soldering.
The component placement height is set too low, can not squeeze the solder paste, causing a short circuit;
It is immediately followed by the component placement stage.
Driving editing documents(component placement, installation and connection of specific levels of design).
Easy to fall off,lead holes are too small, and component placement is difficult.
Schematic document editing component placement, connectivity editing and design rules definition.
Local fiducials are required for precise placement of fine pitched components, in the component placement stage.
SMT(surface mount technology) component placement systems, commonly called pick-and-place machines or P.
With new applications like POP andwafer placement on substrate the industry is moving beyond conventional component placement.
Paste also acts as anadhesiveduring component placement andsolder reflow.
Component placement direction: Components can only be arranged in both horizontal and vertical directions.
There are three primary attributes that shall be considered in the component placement system: accuracy, speed and flexibility.
JEDECguidelines for PCB component placement, soldering, and inspection are commonly used to maintainquality controlin this stage of PCB manufacturing.
Since feeder problems are the a major source of downtime, the repair andmaintenance of feeders are crucial for the component placement operations.
SMT(surface mount technology) component placement systems, commonly called pick-and-place machines or P.
ODB++ covers the specification of not only conductor layer artwork and drill data, but also material stack up,netlist with test points, componentbill of materials, component placement, fabrication data, and dimension data.
The schematic editor includes basic component placement and circuit design as well as advanced multi-channel design and hierarchical schematics.
JEDEC guidelines for PCB component placement, soldering, and inspection are commonly used to maintain quality control in this stage of PCB manufacturing.
The PCB's documents should include the hardware dimensional drawings, schematic, BOM,layout file, component placement file, assembly drawings and instructions, and Gerber file set.
For example, if a process may be done automatically by machines(i.e. SMT component placement and soldering), such process is likely to be cheaper than doing so by hand.
SMT(surface mount technology) component placement systems, commonly called pick-and-place machines or P&Ps, are roboticmachines which are used to place surface-mount devices(SMDs) onto a printed circuit board(PCB).
This is because of difficulties in use with automated component placement machinery, and poorer reliability because of reduced vibration and mechanical shock resistance in the completed assembly.
However, when the amount of solder is large, the component placement pressure will squeeze the solder paste under the component body(insulator), and it will be melted during reflow soldering.
Vacuum nozzles are commonly used for handling all the components during the placement operations.
The placement of components This process is to use the placement machine or manual placement of the chip components to the corresponding position of the PCB surface of the solder paste or paste adhesive.