Examples of using Reflow in English and their translations into Finnish
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Place new component and reflow.
Reflow soldering-printed circuit board.
Rework(electronics) Process Reflow….
Example of reflow solderingthermal profile.
This usually follows an SMT oven reflow process;
People also translate
Reflow soldering-Cooling zone-printed circuit board.
New blank solder reflow soldering PCB board.
One is to useinfraredlamps;this is called infrared reflow.
During reflow, solder flows and is drawn to the copper trace.
Paste also acts as anadhesiveduring component placement andsolder reflow.
First posted two SMD, reflow soldering and cartridge, wave solder.
More Features-Form calculations supported-Support ePub-Text View with reflow function.
We have reflow owens with nitrogen and a vapor-phase soldering machines.
Additionally there is no clearance for a soldering pencil to reflow pads under the chip if touch up is desired.
Manufacturer of reflow solder tools, hot bars and resistance welding electrodes.
They guarantee that the granulated solder contained in the solder paste surpasses the reflow temperature of the solder involved.
A high minimum reflow time also provides a margin of safety against oven temperature changes.
Enhanced browsing: Intuitive web browser design features Text Reflow technology to improve website readability.
During this reflow phase, the entire board assembly climbs towards a target soak or dwell temperature.
Becausewave solderingcan be simpler and cheaper, reflow is not generally used on pure through-hole boards.
Power lamps in lighting fixtures, built-in tension ceiling system shall not exceed 40 the W,otherwise likely reflow leaf edges.
Reperfusion injury(no or slow reflow): impaired flow in the heart arteries after they have been reopened.
However, when the amount of solder is large, the component placement pressure will squeeze the solder paste under the component body(insulator), andit will be melted during reflow soldering.
Modern circuit assembly techniques that use reflow soldering do not necessarily allow the solder to flow more than once.
The term"reflow" is used to refer to the temperature above which a solid mass of solderalloyis certain to melt as opposed to merely soften.
Component location is less restricted if the designer knows that vapor phase reflow or convection soldering will be used in production.
In the conventional reflow soldering process, there are usually four stages, called"zones", each having a distinct thermal profile: preheat,thermal soak(often shortened to justsoak), reflow, andcooling.
Oxidation of the exposed chip contact pads after being exposed to a reflow oven during initial assembly makes solder wetting to them during rework quite difficult.
Forced hot air reflow soldering is divided into two types according to its production capacity: Applicable to mass production Suitable for mass production PCB board placed on the conveyor belt, it has to go through several fixed temperature zones in sequence, there will be temperature jump phenomenon when the temperature zone is too small, and it is not suitable for high density assembly board welding.
If the circuit board is double-sided then this printing,placement, reflow process may be repeated using either solder paste or glue to hold the components in place.