Examples of using Interflux in English and their translations into German
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Interflux Tip Tinner cleans and retins tips of soldering irons.
IF2005M, the first of its kind body-free, No-residueTM flux was conceived,produced and made successful by the Interflux Group.
Interflux IF 2005M is QPL- listed approved to MIL-F-14256F.
Interflux T 2005M is the thinner/ conditioner for the IF 2005-series fluxes.
Interflux µ-dIFe 7 is a no-clean, lead-free solder paste for dipping applications.
Interflux IF 930cleans and de-oxidizes wettable nozzles of selective soldering systems.
Interflux DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
Interflux IF 2005K with 2,5% of solids is a resin- and rosin-free, no-clean flux.
Interflux Purgel is a neutral cleaner/ conditioner for pumps and valves of dispensing systems.
Interflux IF 7500HAB is a no-clean, halide-free tacky gel flux with increased process window.
Interflux IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.
Interflux IF 9009LT is a no-clean solder paste with increased activity in SnPb(Ag) and lead-free alloys.
Interflux Aquasol 4018 is a high activity solder wire with water soluble residues in lead-free alloys.
Interflux LMPA -Q6 is a no-clean solder paste with the high reliability LMPA-Q low melting point alloy.
Interflux pre-saturated IPA/DI wipes in flip-top tubs and refill bags for general cleaning of surfaces.
Interflux PacIFic 2009M is a water based no-clean flux mainly used for wave and selective soldering.
Interflux DP 5505 is our general purpose, high stability, no-clean solder paste in SnPb(Ag) and lead-free alloys.
Interflux Flexsol 903 is an absolutely halide-free, no-clean solder wire with reduced spattering properties in lead-free alloys.
Interflux SelectIF 2040 is a water based no-clean selective soldering flux with a wide process window and low residue formation.
Interflux IF 8001 is a solvent based, no-clean soldering flux with low residue formation for selective fluxing applications.
Interflux IF 6000 is a rosin containing, no-clean soldering flux with increased process window for selective fluxing applications.
Interflux AF 4818 PbF is a solvent based, rosin containing, no-clean soldering flux with increased solid content and a large process window.
Interflux OSPI 3311M is an alcohol based no-clean flux for soldering OSP finished boards that have passed one or more reflow cycles.
Interflux LP 5720 is a no-clean solder paste with optimized printing stability and transparent residue after reflow, in lead-free and SnPb(Ag) alloys.
Interflux QF 70 is an absolutely halide-free, rosin based no-clean solder wire with fast wetting for fast soldering operations in lead-free alloys.
Interflux IF 14 series are colophony free, absolutely halide-free, no-clean solder wires with easily removable residues in lead-free and SnPb(Ag) alloys.
Interflux RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability on surfaces that are difficult to solder in lead-free alloys.
Interflux NH 1 is a no-clean colophony free activated solder wire that gives fast and repeatable soldering results on a wide range of surfaces including brass, in lead-free alloys.
