Examples of using Solderability in English and their translations into German
{-}
-
Colloquial
-
Official
-
Ecclesiastic
-
Medicine
-
Financial
-
Ecclesiastic
-
Political
-
Computer
-
Programming
-
Official/political
-
Political
Solderability[-] good good.
Good cold formability, good solderability.
Solderability[-] good good good good.
Storage time 12 months, solderability 6 months.
Reflow solderability metallized polyester capacitor.
People also translate
Purest- grade gold flash 0.05- 0.3 µm Improved solderability.
How are the solderability and processability of ISA-WELD components guaranteed?
This refinement serves for improved solderability and durability.
Epoxy conformity and control providing for consistent physical dimensions and improved solderability.
For surfaces with easy solderability, the Flux Solder Fluid No. 1V is applied thinly.
Temperature index TI Cut through temperature(pre-heated block)Dielectric loss factor Heat shock at 200 Solderability at 390 °C.
Therefore, it is very often necessary to check the solderability of components or also circuit boards.
In addition to the solderability, the resistance to the heat produced by soldering is one of the significant factors in this area of testing.
If the surface is difficult to solder, better solderability can be achieved by mechanical roughening.
High humidity with high temperature canaccelerate the oxidation of the solder plating on the termination and reduce the solderability of the components.
The process exhibits excellent solderability, and meets the requirements of EU Directive RoHS 2002/95/EC.
Especially in the particular case of obsolete components one is confronted with the problem to determine the solderability objectively and quantitatively.
Tin plating is primarily used for its good solderability in electric engineering and for its drawing and sliding….
Good alloying of semiconductors Flawless bonding of connector leads(bonding wire Au or Al)Very good solderability without aggressive flux.
Ultra low lead• brilliant solderability and very good wetting• low scratch formation• long life in comparison to thermal fatigue properties• price.
The finished inductors are welded into film to maintain the solderability and are back-gassed with nitrogen.
Temperature index TI Cut through temperature(pre-heated block) Dielectric loss factor Heat shock at175 °C(no cracks in varnish after winding) Solderability at 390 °C.
Tin plating is primarily used for its good solderability in electric engineering and for its drawing and sliding properties in special applications.
Temperature index Cut through temperature(pre-heated block) Dielectric loss factor(bending point) Heat shock at 175°C(no cracks in varnish coat after winding) Solderability at 375 °C.
Corrosion protection, appearance, electrical properties, wear protection, slipperiness and solderability are usually only achieved by these very thin metal layers.
The solderability of the component connections was also optimized, in addition Gold plating does not allow connections to corrode and it creates excellent solderability in the reflow soldering process.
A special feature of this wire is the efficient and safe bonding via quick solderability at solder bath temperatures of 390 °C and higher without previous mechanical dissolving of the coating.
Very good solderability with high thermal properties. Good solderability at 370°C and elevated thermal values Solderable at high temperatures, high thermal properties and good chemical resistance. Very high thermal properties and good chemical resistance. Very high thermal properties and high mechanical resistance High thermal properties, good chemical resistance Excellent thermal properties, excellent chemical and high radiation resistance.
An elegant appearance, properties such as high electrical conductivity, wear resistance,good solderability and excellent tarnish resistance make these valuable precious metals indispensable for coatings on connectors and contacts in electronics all the way to slip rings in the wind power industry.
Very good solderability with high thermal properties. Very good solderability and high thermal properties, no elongation pinholes Good solderability at 370°C and elevated thermal values Solderable at high temperatures, high thermal properties and good chemical resistance. Very high thermal properties and good chemical resistance. Very high thermal properties and high mechanical resistance High thermal properties, good chemical resistance Excellent thermal properties, excellent chemical and high radiation resistance.