Examples of using Wafer surface in English and their translations into German
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Colloquial
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Official
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Ecclesiastic
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Medicine
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Financial
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Ecclesiastic
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Political
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Computer
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Programming
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Official/political
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Political
Discover patterns on wafer surfaces.
The wafer surface is inspected on the fly, i.e. with a moving sample.
Fully automatic quality testing of wafer surfaces.
The advantage is that the wafer surface is not damaged by accelerated ions.
Visualize electrical test data on wafer surfaces.
By regular rotation of the kettle, the wafer surface is covered with a uniform layer of chocolate.
Measurement of machined, ceramic, and wafer surfaces.
Direct bonding describes a process in which wafer surfaces are bonded to one another in order to build up multilayer structures, for example for high-frequency technology.
Complete detection of microcracks on the wafer surface.
Modules provide the VPD functions of etching the native oxide andscanning the wafer surface with a droplet to collect a sample for ICP-MS analysis.
Caused by the rotation, the material is distributed homogeniously over the wafer surface.
The force measurementsled the scientists to experiment with specially prepared wafer surfaces and glass plates at various levels of air humidity.
This tiny notches on the edge of the disk also provide an alignment of the wafer, but take up much less costly wafer surface.
By strategically positioning a rotatable holderfor 6-inch wafers off-center, users can observe the whole wafer surface by just rotating the holder when moving through the 100 mm travel range.
Completely checked classification and regrouping of near-surface molecules are reached at the electric fieldapplication between a needle of a scanning tunnel microscope(STM) and a wafer surface.
Colloidal silica was first used for polishing wafers ofsingle crystal silicon where all of the damage on the wafer surface must be eliminated before a device can be grown on it.
They test optical, processed, ceramic and wafer surfaces.
Chemical dry etching: chemical reaction of gas and wafer surface.
It is accomplished by the use of special materials andcareful management of the bonding environment to protect the wafer surface while it is fully populated with dice.
If there is only few hydrogen in the atmosphere, as in the trichlorosilane process for the purification of raw silicon,material is removed from the silicon wafer surface due to the high chlorine concentration.
A special challenge in the semiconductor manufacturing with small structure widths are airborne, gaseous substances,which unwanted chemical reactions at the wafer surface and process interfaces can release.
In this way, the device, which is set up in an air-conditioned laboratory room(temperature stability: 0.5 °C),is used for the testing of the so-called"off-angle" between the wafer surface and the lattice plane on selected reference samples made of Si, Ge and GaAs.
