Examples of using Semiconductor processing in English and their translations into Korean
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Many PVD tools used for semiconductor processing deploy cryo pumps.
But, this removal rate is generally considered too high to control with current semiconductor processing tools.
그러나, 이 제거 속도는 현재의 반도체 처리 장치로 제어하기에 너무 높은 것으로 생각된다.The EPX Series supports clean and light duty semiconductor processing applications such as ash/strip and implant end station applications.
EPX 시리즈는 애싱(Ashing)/포토레지스트 제거 및 주입 엔드 스테이션 응용 분야 같은 무공해 및 저부하 반도체 공정 응용 분야를 지원합니다.Also, the overall manufacturing process of an MDM is considerably simpler than even the most basic semiconductor processing techniques.
Originally designed for demanding semiconductor processing systems, the robust SL2KW is ideal for a myriad of scientific and industrial applications.
원래, 까다로운 반도체 프로세싱 시스템에 맞게 설계된 이 견고한 SL2KW 제품은 무수히 많은 과학 및 산업용 응용제품에 적합합니다.AlSi42 alloy is used in pick-and-place assemblies for semiconductor processing equipment;
AlSi42는 반도체 공정 장비의 픽앤 플레이스 (pick-and-place) 어셈블리에 사용됩니다.Semiconductor Processing  The fully magnetically-levitated rotor has been designed to reduce the risk of contamination to the chamber and extend service intervals, making the STP Maglev Turbomolecular Pumps the reliable choice for your process tool.Â.
반도체 공정 완전 자기 부양식 로터로 챔버 오염 위험을 줄이고 서비스 간격을 늘리도록 설계된 STP Maglev 터보 분자 펌프는 프로세스 도구를 안심하고 선택할 수 있습니다.Sapphire is also the ideal material for high purity chemical processing, semiconductor processing, and plasma systems.
사파이어는 또한 고순도 화학 As a disposable device manufactured using high-volume semiconductor processing technologies, the MEMS-based Jewel Pump is also much more affordable, allowing the patient or the healthcare system to avoid the substantial up-front investment typically associated with current pump solutions.
높은 볼륨 반도체 가공 기술을 사용하여 제조된 처분할 수 있는 장치로, MEMS 기지를 둔 보석 펌프는 또한 훨씬 적당하, 전형적으로 현재 펌프 해결책과 관련되었던 상당한 솔직한 투자를 피하는 것을 환자 또는 보건 의료 시스템이 허용하.The iHP power system also has industrial safety approvals and meets the SEMI F47 voltage sag tolerance standard for semiconductor processing equipment.
또한 iHP 전력 시스템은 산업 안전 승인을 받았으며 반도체 처리 장비를 위한 SEMI F47 전압 저하 허용 기준을 충족한다.Samsung Electronics' Efforts to Reduce Greenhouse Gases In semiconductor processing, cleaning the surface of silicon wafers requires the use of F-Gas, a type of greenhouse gas.
온실가스를 줄이기 위한 삼성전자의 노력 반도체 공정에는 웨이퍼 표면을 세정할 때 온실가스의 한 종류인 F-Gas를 사용합니다.The STR's robust IGBT inverter is inherently fault tolerant and is ideal for demanding applications like semiconductor processing and vacuum deposition.
STR의 강력한 IGBT 인버터는 자체 고장 방지 기능이 포함하고 있으며 반도체 공정 및 진공 증착과 같은 응용 수요에 이상적이다.Typical applications for engineering plastics range from semiconductor processing equipment components to heavy equipment wear parts, to food processing industry components.
엔지니어링 플라스틱의 일반적인 애플리케이션은 반도체 가공 장비부터 중장비 마모 부품, 식품 The STA's robust IGBT inverter is inherently fault tolerant and is ideal for demanding applications like semiconductor processing and vacuum deposition.
STA의 견고한 IGBT 인버터는 기본적으로 고장 방지형 (fault tolerant)이며 반도체 공정 및 진공 증착과 같은 적용에 이상적이다.The FA& Equipment BU provides SMT processing equipment, semiconductor processing equipment, optical communication products, UV plastic packaging, welding process equipment, and a complete set of customized services, from development, to design, to manufacturing, in response to customer demand.
FA & Equipment BU는 고객 요구에 부응하여 SMT The ST's robust IGBT inverter is inherently fault tolerant, making the series ideal for demanding applications such as semiconductor processing and vacuum deposition.
ST의 강력한 IGBT 인버터는 고유의 내고장성(fault tolerant) 기능을 갖췄으므로, 이 시리즈는 반도체 프로세싱과 진공 증착같은 까다로운 용도에 이상적입니다.The newest of our semiconductor processing platforms, the Centris clusters up to six independent process chambers and two plasma clean chambers, uniquely incorporated into the vacuum loadlocks, around a high-speed transfer robot that enables throughput of up to 180 wafers per hour- nearly twice that of competing alternatives.
가장 최근에 나온 반도체 처리 플랫폼인 Centris 시스템은 웨이퍼 처리량이 경쟁 제품보다 거의 두 배나 높은 시간당 최대 180개에 이르는 고속 이송 로봇 주변에 최대 6개의 독립적인 공정 챔버와 진공 로드록에 독창적인 방법으로 결합된 2개의 플라즈마 세정 챔버로 구성되어 있습니다.In fact, silicon is not even required for the operation of the PR/C. Also, the overall manufacturing process is considerably simpler than even the most basic semiconductor processing techniques.
In fact, silicon is not even be required for the operation of the PR / C. 또한, 전체 제조 과정은, 심지어 가장 기본적인 반도체 제조 공정의 경우 보다 상당히 더 간단하다.For example, well known equivalent materials may besubstituted in place of those described herein, and similarly, well known equivalent techniques may be substituted in place of particular semiconductor processing techniques disclosed herein.
예를 들면, 여기에서 설명된 것들 대신에 잘알려진 균등 재료들이 대용될 수 있고, 마찬가지로, 개시된 특정 반도체 프로세싱 기법들 대신에 잘 알려진 균등 기법들이 대용될 수 있다.These devices are then separated from one another by a technique such as dicing or sawing, whence the individual devices can be mounted on a carrier, connected to pins, etc. Further information regarding such processes can be obtained, for example,from the book“Microchip Fabrication: A Practical Guide to Semiconductor Processing”, Third Edition, by Peter van Zant, McGraw Hill Publishing Co., 1997, ISBN 0-07-067250-4.
After the devices are separated from one another by a technique such as dicing or sawing, whence the individual devices can be mounted on a carrier, connected to pins 이러한 공정에 관한 추가 정보는 예를 들어, 본 명세서에서 참고자료로 채택된 "Microchip Fabrication:A Practical Guide to Semiconductor Processing" (3판, Peter van Zant 저, McGraw Hill 출판사, 1997, ISBN 0-07-067250-4)으로부터 얻을 수 있다.These devices are then separated from one another by a technique such as dicing or sawing, whence the individual devices can be mounted on a carrier, connected to pins, etc. Further information regarding such processes can be obtained, for example,from the book“Microchip Fabrication: A Practical Guide to Semiconductor Processing”, Third Edition, by Peter van Zant, McGraw Hill Publishing Co., 1997, ISBN 0-07-0672504.
These devices are then diced, or isolated from one another by a technique such as sawing, whence the individual devices it can be mounted on a carrier, connected to pins 이러한 공정에 관한 추가 정보는 예를 들어, 본 명세서에서 참고자료로 채택된 "Microchip Fabrication:A Practical Guide to Semiconductor Processing" (3판, Peter van Zant 저, McGraw Hill 출판사, 1997, ISBN 0-07-067250-4)으로부터 얻을 수 있다.What is semiconductor PKG processing?
반도체 PKG 공정이란?Adhesive materials used for semiconductor PKG processing.
Zebrafish Research Automotive Transportation Semiconductor Wafer Processing IC Packaging Testing Printed Circuit Board.
제브라피시 연구 자동차 Semiconductor Wafer Processing IC Packaging Testing Printed Circuit Board.Today's semiconductor chip processing involves hundreds of discrete steps and extremely expensive machines and equipment.
Zebrafish Research, Automotive& Transportation, Semiconductor Wafer Processing, IC Packaging& Testing, Printed Circuit Board(PCB)& Electronics Manufacturing, Art Conservation.
제브라피시 연구, 자동차 분야, Semiconductor Wafer Processing, IC Packaging & Testing, Printed Circuit Board (PCB) & Electronics Manufacturing, 예술 작품 복원.Materials& Earth Science, Energy, Mining and Natural Resources, Automotive& Transportation,Medical Device Manufacturing, Semiconductor Wafer Processing, IC Packaging& Testing.
재료 및 지구 과학, Energy, Mining and Natural Resources, 자동차 분야,의료기기 제조, Semiconductor Wafer Processing, IC Packaging & Testing.Semiconductor Wafer Processing Tape SWT 20+R Semiconductor wafer processing tape designed for excellent stability under various conditions of processing. .
반도체 웨이퍼 테이프 SWT 20+ 다양한 공정 조건에서 탁월한 안정성을 제공하도록 개발된 웨이퍼 처리 테이프.Nitto Semiconductor Wafer Tape SWT 10T+R is an ideal product for processing semiconductor wafers, to be applied on the backside of the wafer(non-active side).
적용 Nitto 반도체 웨이퍼 테이프 SWT 10T+는 반도체 웨이퍼 처리에 이상적인 제품으로, 웨이퍼 이면(비활성 면)에 도포됩니다.
