Examples of using Surface mount in English and their translations into Romanian
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Surface Mount Device.
Package Type: Surface Mount.
Surface mount capabilities include.
Hot Selling for Surface Mount Film Capacitors-….
Surface mount electronic components.
Production Process: use of surface mount technology.
Dense surface mount assembly.
PGA packages cannot be soldered down using surface mount technology.
Making surface mount easier.
PGA packages cannot be soldered down using surface mount technology.
Chip Resistor- Surface Mount Electronic Distributor.
Finally, 180Tg is used for high reliability double-sided surface mount PCB.
Surface mount components forbidden cloth area.
In both through hole and surface mount, the components are then soldered.
Surface Mount Machine Reflow Oven Automated Optical Inspection AOI.
Volume production, including fine pitch component. Surface mount capabilities include.
Both surface mount and through-hole components have been used.
Use the screw holes in the back of the frame to align and surface mount.
Magnetic shielded surface mount inductor with high-current rating.
The test pad surface has the same surface finish as the surface mount pad.
Surface mount technology(SMT) is used for surface mounting components.
It is therefore highly desirable to develop surface mount packages having high thermal conductivity.
Surface mount components, including resistors, transistors and an integrated circuit.
Thick film resistors became popular during the 1970s, and most SMD(surface mount device) resistors today are of this type.
Surface mount components are placed along the front(and often back) faces of the machine.
Boards in the same manner andat the same time as other surface mount components prior to the automated reflow solder process.
Ultra-Bright surface mount LED's available in White, Warm white and Custom Colors Available Upon Request.
Unlike pin grid arrays, land grid array packages are designed to fiteither in a socket, or be soldered down using surface mount technology.
We offers surface mount technology(SMT) assembly services from proto-type through medium and high.
BGA, short for ball grid array, is a form of SMT(Surface Mount Technology) package that is increasingly used in integrated circuits(ICs).