Examples of using Magnetron sputtering in English and their translations into Russian
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Example of modernization of Machine for Magnetron Sputtering UVN-71P3.
Magnetron sputtering of super-hard nanocomposite nc-TiC/a-C coatings(Ukraine) 4.8.
The key component for magnetron sputtering is the magnetron.
Magnetron sputtering of metal coatings with controlled thickness in the range from 1 to 1000 nm.
For a while it was a combination of both technologies, andthen we completely passed to the magnetron sputtering.
Keywords: surgical meshes;silver coating; magnetron sputtering; antibacterial action; bacteriostaticity.
Keywords: magnetron sputtering, metal atoms, coating synthesis, high-energy ions, substrate, atoms mixing, adhesion.
Deposition rates can be increased 10 to 100 times with a single electron beam evaporation process compared to magnetron sputtering.
The use of ion-beam and magnetron sputtering allows to conduct reactive and non-reactive processes in any sequence;
The structure andthe properties of the porous films obtained by self-organization during magnetron sputtering the composite target are investigated.
With magnetron sputtering, a magnetic field-enhanced plasma discharge is generated in a medium vacuum and a defined gas atmosphere.
The book contains a detailed description of magnetron sputtering systems and plasma chemical etching systems for thin films.
For production of planar nanostructure of a nanoelectronic transducer the standard photolithography technology, various photoresist,jet ionic etching and a magnetron sputtering was used.
Izovac is glad to offer the"Atis"- family of vacuum equipment with magnetron sputtering and ion-beam pre- cleaning developed specially for microelectronics applications.
Magnetron sputtering of metal and silicide targets; ion-beam cleaning and etching of layers; dry photoresist removal; depositing protective dielectric coatings above the resistive layer; depositing/etching to a preset thickness with resistance control.
Laboratory of vacuum technologies commercializes high-productive machines NIKA for magnetron sputtering of crockery, cutlery, accessories.
The book contains a detailed description of magnetron sputtering systems, plasma chemical etching systems for thin film and the technological features of their use.
It is a detailed description of the physical processes occurring during reactive magnetron sputtering and its technological features.
It is hoped that the magnetron sputtering technology opportunities are not yet fully exhausted, but one has to admit that today, some stagnation in obtaining of new results in multilayer X-ray optics takes place.
Methods were developed for surface modification of track membranes by low-temperature plasma, magnetron sputtering of titanium dioxide, and chemical adsorption of nanoparticles of chitosan and silver 14.
Ion-beam cleaning of substrates; magnetron sputtering of metal targets; magnetron sputtering of magnetic materials(nickel); thermal evaporation in magnetron discharge with a high speed of deposition up to….
Although Bühler Leybold Optics is active in developing all differentfields of coating technologies, for ex- ample PECVD or evaporation methods, magnetron sputtering is still the technology of choice in large area coating.
The process used at UNION GLASHÜTTE,known as magnetron sputtering, is a combination of evaporation process and sputtering cathode sputtering. .
We offer the complete spectrum of vacuum thin-film deposition technologies, from evaporation, sputtering, plasma-enhanced chemical vapor deposition(PECVD) andenhancements of the technologies such as plasma-assisted reactive magnetron sputtering PARMS.
Depending on their purpose, machines may be retrofitted with process devices: magnetron sputtering systems, ion beam sources, heaters, radio-frequency plasma generators, as well as modern units, vacuum gauges and sensors.
Although all vacuum ion-plasma technologies are based on materials sputtering techniques aimed for production of ionized plasma,those of principal importance are cathode sputtering, high frequency sputtering, magnetron sputtering, electric beam sputtering and electric arc sputtering. .
Depending on their purpose, machines may be retrofitted with process devices: magnetron sputtering systems, ion beam sources, heaters, radio-frequency plasma generators, as well as modern units, vacuum gauges and sensors.
Purpose: deposition of resistive layers, ion-beam cleaning andetching Processes: magnetron sputtering of metal and silicide targets; deposition of composite layers by co-sputtering from two targets; ion-beam cleaning and etching of layers; depositing protective dielectric coatings above the resistive layer; depositing/etching to a preset thickness with resistance control.
Annotation: In this article were studied electrical properties of the titanium dioxide films,which were obtained by magnetron sputtering cathode of titanium, stoichiometric(TiO 2) and unstoichiometric(TiO x) compositions used for creating the elements of non-volatile memristor's memory.
Ion-beam cleaning of substrates,including low-energy one(ion energy up to 40 eV); magnetron sputtering of an adhesive underlayer(Cr, Ta, Ti); reduction treatment in hydrogen plasma; dry removal of photoresist by oxygen or hydrogen plasma etching; deposited layer thickness monitoring by resistance, a quartz thickness gauge or by time; PVD of conductive and resistive layers by thermal evaporation.