Examples of using Advanced packaging in English and their translations into German
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Political
Aptitude is a front-end to the Advanced Packaging Tool APT.
From a regional perspective Asia posted the fastest growth,not least due to the considerable increase in business for products in the Advanced Packaging market.
For example numerous MEMS technologies and in the advanced packaging area, especially for the packaging of CMOS image sensors.
This is where Finetech's years of experience in precision machine engineering for advanced packaging came into play.
The BA Gen4 series is utilized in advanced packaging, MEMS production and whenever sub-micron precise alignment and high precision repeatability are required.
This is due to the strong demand for equipment andprocess solutions for advanced packaging applications.
Advanced Packaging Centre; the development of advanced electronic packaging to package sensors so that sensors/chips can connect optimally with the environment.
You will gain expertise in using thelatest methods of hardware development such as advanced packaging- an ultra-compact mounting technology.
APT(the Advanced Packaging Tool) is an advanced interface to the Debianpackaging system consisting of several programs whose names typically begin with"apt.
Key end-use markets such as building and construction, as well as automotive and advanced packaging should benefit substantially from these investments.
Key end-use markets for Borealis' pioneering PP grades set to benefit from this investment include applications in infrastructure,automotive and advanced packaging.
With two booths at Productronica 2017 in Munich,Finetech presented new product highlights for Advanced Packaging and SMD-Rework and attracted more visitors than ever.
EVG's"Maskles Exposure" technology brings unprecedented flexibility and scalability to development andpilot as well as high-volume production in advanced packaging.
Additionally, the strong demand for advanced packaging that enables the miniaturization of electronic products is driving growth for companies in the Zacks Electronics- Manufacturing Machinery industry.
The participants could followdiscussions and presentations on new developments in Advanced Packaging, materials and market trends in 3D IC.
All items are produced from the same high-class raw materials like our BARF-frozen food(Rumen, Chicken-Beef-Mix, Beef Muscle Meat etc.)and are made long-time durable through a gentle special-cooking method and an advanced packaging.
Borealis focus on providing innovative plastic materials to the infrastructure,automobile and advanced packaging markets across Europe, the Middle East and Asia.
The plant will enable accelerated development and commercialization of highly innovative material solutions that meet the growing needs of various industries, including automotive, health- and personal care,appliances and advanced packaging.
Founder, managing director andshareholder of Microelectronic Packaging Dresden GmbH as service provider for advanced packaging of integrated circuits, sensors and microsystems.
Using the proprietary Borstar® und Borlink™ technologies and with 50 years of experience in the field of polyolefins(polyethylene and polypropylene), Borealis and Borouge supply products to key industries in the areas of infrastructure,automotive engineering and advanced packaging.
The underlying strategic orientation of the company shall be maintained,as SUSS MicroTec aims its products toward the MEMS and advanced packaging applications markets as well as 3D integration and compound semiconductors(LED)- the areas that presumably have the greatest growth rates in the entire semiconductor market.
These two investments underline Borealis' strong commitment to providing customers with infrastructure,automotive and advanced packaging solutions.
The underlying strategic orientation of the company shall be maintained,as SUSS MicroTec aims its products toward the MEMS and advanced packaging applications markets as well as 3D integration and compound semiconductors(LED)- the areas that presumably have the greatest growth rates in the entire semiconductor market.
With more than 40 years of experience in polyolefins and using our unique Borstar® technology, we focus on the infrastructure,automotive and advanced packaging markets.
The JOANNEUM Power Electronics Center has been concentrating on a comprehensive optimisation approach in relation to topologies, filters(including electromagnetic compatibility,EMC), advanced packaging and the associated dynamic controls on the basis of a combination of high-performance microprocessors and configurable logic FPGA.
With more than 40 years of experience in polyolefins and using our unique Borstar® technology, we focus on the infrastructure,automotive and advanced packaging markets.
About SUSS MicroTec SUSS MicroTec is a leading supplier of process andtest solutions for markets such as 3-D Integration, Advanced Packaging, MEMS, Nanotechnology and Compound Semiconductor.
With more than 40 years of experience in polyolefins and using our unique Borstar® technology, we focus on the infrastructure,automotive and advanced packaging markets across Europe, the Middle East and Asia.
We are excited to deepen our relationship with the Georgia Institute of Technology,which is a leading industrial research partner for the high potential growth markets of bio-medical and emerging advanced packaging applications, like 3D-IC, 2.5D interposer solutions and panel size packaging”.