Examples of using Etching process in English and their translations into German
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Sacrificial layer for Si etching process in TSV.
A reliable etching process for 75µm structures is only possible with thin copper thicknesses maximum 25- 30µm.
In addition,the wax can be stripped very easily after the etching process.
Sacrificial layer for SiO 2 or SiN etching process in CMOS sensor processing.
Virgin orfilled PTFE surfaces can be treated chemically with etching process.
The hydrogen bromide etching process allows creation of such structures in silicone.
A technology for acid recovery from pickling and etching process water weiter lesen.
However, with a new etching process for surfaces, metals can be bonded with almost all materials on a permanent basis.
It can process large-scale waveguide devices on the silicon substrate by etching process.
The copper conductor image is produced by an etching process in a highly economical roll-to-roll process. .
It can process large-scale waveguide devices on the silicon substrate by etching process.
The New Etching Options(NEO) enable a perfect etching process with qualities that were considered unachievable until recently.
Field solvers assume either a rectangular or trapezoidal cross section for tracks,as that is the normal result of a high quality etching process.
With the New Etching Options SCHMID enables an etching process with qualities that were considered hard to achieve until recently.
On the first three pictures show the etcing machine(in the third picture, it is actually working),the other pictures show the PCB during the etching process.
The printed circuit board manufacturer widens the tracks so that after the etching process, the nominal dimension of the design data will be achieved.
After the etching process, additional chemical treatments follow as well as largely automated processes, such as laser processing and adjustment.
Special precautions should alreadybe taken in the design of the board as due to the etching process, only wider conductor structures are possible.
The application of fluoride after the etching process is very important so as to remineralise enamel which has been etched but is not covered by the filling.
Partially perforated foil orlayer applied to a surface prior to an exposure or etching process to selectively protect particular surface regions.
The targeted etching process of"nanoscale-sculpturing" roughens the upper layer of metal(here aluminium, 20 Âμm 0.02 mm), thereby creating a 3D-structure with tiny hooks.
C, the nanoparticles arepartially etched by, for example, a wet chemical etching process to adjust the size of the gap between the nanoparticles.
The portfolio of applications for treatment of photo resist includes the removal of resist from different substrates, removal of a sacrificial layer, descumming,cleaning deep trenches in Silicon after the Bosch etching process.
This fundamentally new method is based on using an electro-chemical etching process, in which the uppermost layer of a metal is roughened on a micrometer scale in a tightly-controlled manner.
The bipolar electrolytic capacitors of the ECap AC- Audio Coupling& Signal Cap RAW series havefoils with surfaces which are roughened by a special etching process thus enlarging the surface.
Details Details In this combined printing and etching process the high phosphorous doping on the cell is selectively etched and maintained only there where contacts are printed subsequently.
An etching speed increased by up to 25%, line/space structures of less than 50 μm and etching factors greater than 6:With the New Etching Options SCHMID enables an etching process with qualities that were considered hard to achieve until recently.
With specific technologies, providing uniformity on surfaces, we can supply the etching process on semifinished(sheets, tapes, tubes, bars) and finished PTFE Products, virgin or compounded.
The Fineline spray system andthe intermittent etching with single nozzle control enable an etching process with qualities that were considered hard to achieve until recently.
These were essentially as follows: The present state of the art did not permit an etching process using hydrogen peroxide in an acid solution to be carried out economically without the addition of stabilisers.